Optimal transmitter devices for optical transceivers employing 56 GBd and 112 GBd PAM4 modulation.
Our high-speed EML chip delivers excellent bandwidth and optical signal quality for high-speed datacom links. These high-performance, high-reliability devices are engineered and qualified for cost-effective non-hermetic packaging.
EML Chip
Use these high-performance emitters for Datacom fiber communication links from 100G to 3.2T. Future-proof design based on proven InP technology.
Key Features
Available alternatives: 112 Gb/s (56 GBd PAM4 modulation) or 224 Gb/s (112 GBd PAM4 modulation)
Available wavelengths: CWDM
Compatible with cost-effective non-hermetic packaging
Operating temperature 50-60 °C
Integrated RF termination resistor provides for superior signal integrity
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
