Dymax 501-E-REV-A Activator is a pre-applied treatment for metallic, plated, ceramic, or glass substrates – including printed circuit boards (PCBs) – to rapidly cure Multi-Cure® 600 series and 800 series structural adhesives and thermal interface materials. It supports bonding in gaps ranging from less than 1 mil to 20 mils.
Using this activator enhances bonding efficiency, consistency, and reliability while offering broad tolerance for adhesive-to-activator ratios. When paired with Dymax metal bonding adhesives, it enables bond strengths of up to 3,500 psi within 10 to 30 seconds, even between opaque surfaces.
Compatible with:
- Dymax 600 & 800 Series Structural Adhesives
- Thermal Interface Adhesives
The product is environmentally safe, containing no VOCs or ODCs, and features low volatility and a high flash point for enhanced workplace safety.
RoHS Compliance: Fully compliant with RoHS Directive 2015/863/EU.
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
