Dymax 9008 is a clear UV-curable encapsulant tailored for chip-on-board and chip-on-flex applications on flexible PCBs. Cured in seconds with UV light and remaining flexible down to −40 °C, it ensures reliable protection in bending and thermal environments.
Features
- Rapid UV/Visible cure yields a tack‑free surface in seconds.
- High flexibility minimizes stress on components.
- Excellent moisture resistance for electronic assembly.
- Solvent-free, low-VOC, isocyanate- and halogen-free formulation.
- Thixotropic for precise dispensing control.
- Low dielectric constant suitable for high-frequency devices.
- Low modulus flexible layer reduces mechanical stress.
Specifications
- Viscosity: ~4,500 cP
- Hardness: Shore A85 (~D35)
- Tensile strength: ~10 MPa (~1,500 psi)
- Elongation at break: ~270%
- Modulus: ~45 MPa (~6,500 psi)
- Glass transition (Tg): ~55 °C
- CTE: ~131–230 µm/m·°C
- Water absorption (2 h boil): ~2.4%
- Linear shrinkage: ~1.2%
- Dielectric constant (1 MHz): 5.07; breakdown ~560 V/mil
- Volume resistivity: ~1.8×10¹³ Ω·cm
Applications
- Encapsulation of chip-on-board, chip-on-flex, and wirebond on flexible or rigid PCBs.
- Electronics for medical, automotive, aerospace, wearable, and consumer devices.
- Benefits
- Ultra-fast cure – tack‑free in seconds improves production speed.
- High flexibility protects parts under bending and thermal stress.
- Energy-efficient process – no ovens needed; low VOC.
- RoHS compliant: eco‑friendly and user‑safe.
- Thixotropic control enables accurate material application.
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
