Dymax 9014 is a next-generation dual-cure encapsulant designed for electronic applications requiring fast UV curing and secondary moisture cure in shadowed areas. It cures within seconds under UV/Visible light and continues curing in areas not exposed to light, making it ideal for printed circuit boards (PCBs) with complex geometries.
One of the key advantages of 9014 is its room-temperature stability, eliminating the need for cold storage or refrigerated shipping, thus simplifying logistics and reducing costs.
This product delivers excellent flexibility, high durability, and environmental resistance, offering reliable protection against moisture and corrosion for sensitive components in applications such as wire bonding, chip-on-board, chip-on-flex, and chip-on-glass, especially in EV battery management systems and other high-performance electronics.
Dymax materials are solvent-free and cure rapidly, enabling efficient, high-throughput manufacturing. When cured with Dymax light-curing spot, beam, or flood lamps, 9014 achieves optimal speed, depth of cure, and bond performance.
Complies fully with RoHS Directive 2015/863/EU
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
