9201-W – High-Viscosity IBOA-Free Electronic Encapsulant with Dual UV & Moisture Cure
Dymax 9201-W is an advanced, IBOA-free encapsulant specifically engineered for modern electronics and wearable device assemblies. Formulated without isobornyl acrylate (a known skin sensitizer), this product incorporates low-sensitizing ingredients to support safer end-user contact while maintaining superior performance.
Designed for wire bond encapsulation, chip-on-board, and chip-on-flex applications, 9201-W offers robust electrical insulation and outstanding chemical and environmental resistance. The material has been validated through rigorous reliability testing, including thermal shock, temperature cycling, and vibration.
This colorless, high-viscosity resin cures rapidly under UV/Visible light and features a secondary moisture cure to ensure full polymerization in shadowed or recessed areas.
Compliant with RoHS Directive 2015/863/EU, 9201-W meets global safety and environmental standards. It is especially suitable for high-reliability consumer electronics and wearable devices.
For medical-grade applications requiring biocompatibility, explore our 2000-MW Series, which are both IBOA-free and TPO-free.
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
