Low Shrinkage, Light-Curable Optical Bonding Adhesive Dymax 9204-W
Dymax 9204-W is a low-stress, light-curable adhesive specially developed for optical bonding applications in consumer wearable electronics. With low shrinkage and low modulus, it minimizes displacement after thermal and reliability testing, ensuring long-term alignment and clarity.
This adhesive is highly elongated and flexible, offering excellent resistance to impact and vibration, making it ideal for sealing and packaging optical components in plastic assemblies.
Typical applications include:
- Smartwatch screen bonding
- Earbud assembly
- Augmented/Virtual Reality (AR/VR) headset modules
In addition, 9204-W is engineered with consumer skin safety in mind — making it suitable for devices that are worn close to or in direct contact with the skin. The formulation is optimized to reduce leaching and mitigate risks in case of improper cure.
- Light-curable for high-speed assembly
- Low modulus and low shrinkage for optical stability
- Safe for skin-contact wearables
- Solvent-free and RoHS-compliant
For medical wearable applications, refer to Dymax 2000-MW series of biocompatible adhesives (IBOA- and TPO-free).
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
