Dymax 9309-SC is a high-performance edgebond adhesive that cures rapidly upon exposure to UV/Visible light, delivering fast and effective reinforcement of circuit board components. It is specifically designed to ruggedize fine-pitch leads, leadless components, and CSPs (Chip Scale Packages), serving as an alternative to traditional underfill materials.
Key features:
- Strong adhesion to leadframe, PCB, silicon, and ceramic
- See-Cure color change technology: appears bright blue when dispensed and turns colorless upon full cure, providing visual cure confirmation
- Thixotropic formulation: minimizes flow after dispensing
- Compatible with both needle and jet dispensing systems
Ideal for applications requiring shock resistance, mechanical support, and fast throughput in electronics manufacturing.
Like all Dymax products, 9309-SC is solvent-free and fully RoHS2 compliant (2015/863/EU), supporting cleaner, safer manufacturing processes.
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
