Dymax Dual‑Cure 9101 is a clear dual-cure encapsulant (UV + moisture) engineered to protect electronic components in shadowed areas. Ideal for precision electronics such as chip-on-board, chip-on-flex, and wirebond protection.
Features
- Dual cure (UV + moisture) – UV provides fast tack-free surface; ambient moisture cures hidden areas
- Low viscosity (~5,000 cP) – Enables easy dispensing and precise coverage
- High flexibility, low stress – Safeguards delicate components and wirebonds
- Strong adhesion to FR4, gold, silver, glass, and silicon
- One-part, no-mix formula – Saves time, low VOC, solvent- and isocyanate-free
- Halogen-free and RoHS compliant
Specifications
- Viscosity: ~5,000 cP
- Cured appearance: Clear
- Hardness (Shore D): D30
- Tensile strength: ~4 MPa (580 psi)
- Elongation at break: ~50%
- Modulus: ~20 MPa (2,900 psi)
- Tg: ~55 °C
- CTE: ~90–130 µm/m·°C
- Volume resistivity: ~5 × 10¹³ Ω·cm
- Dielectric strength: ~600 V/mil
- Density: ~1.10 g/ml
- Water absorption (2h boil): ~0.3%
- Cure shrinkage: ~1%
Applications
- Encapsulation for chip-on-board, chip-on-flex, chip-on-glass
- Wirebond protection and PCB conformal coverage
- Electronics requiring fine-detail protection: medical devices, telecommunications, sensors
Benefits
- Streamlined one-part process with no heat steps
- Quick tack-free UV cure enables rapid handling
- Ambient moisture cure completes in 24–48 hours, covers hidden regions seamlessly
- No cold storage required, saving warehouse costs
- Flexible formulation reduces mechanical stress, safeguarding sensitive components
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
