Dymax Dual‑Cure 9102 is a clear, dual-cure encapsulant (UV + moisture) optimized for protecting electronic components and PCBs, especially in shadowed areas. It offers strong adhesion, flexibility, environmental resistance, and a user-friendly one-part process.
Features
- UV/Visible cure delivers a tack-free surface quickly; ambient moisture cures shaded regions
- Low-to-mid viscosity ensures easy dispensing and effective protection
- Excellent adhesion to FR4, gold, silver, and semiconductor surfaces
- Single-component, low-VOC, solvent-free formula
- Halogen-free; compliant with RoHS 2015/863/EU
Specifications
- Viscosity: ~9,000 cP
- Cured color: Clear
- Hardness (Shore D): approx. D35
- Tensile strength: ~6 MPa (870 psi)
- Elongation at break: ~60%
- Modulus: ~30 MPa (4,350 psi)
- Glass transition temperature (Tg): ~65 °C
- CTE: ~100–140 µm/m·°C
- Volume resistivity: ~1 × 10¹⁴ Ω·cm
- Dielectric strength: ~550 V/mil
- Density: ~1.12 g/ml
- Water absorption (2h boil): ~0.35%
- Cured shrinkage: ~1.5%
Applications
- Chip-on-board, chip-on-flex, and chip-on-glass encapsulation
- Wirebond protection and PCB conformal coating
- Electronics requiring moisture and thermal resilience: medical, industrial, automotive
Benefits
- One-part system simplifies manufacturing process
- Fast UV cure enables immediate handling and downstream processing
- Ambient cure completes in 24–48 hours, eliminating need for secondary heat cure
- No refrigeration required—reduces storage costs
- Flexible formulation reduces mechanical stress on components
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
