Dymax Dual‑Cure 9103 is a clear, dual-cure encapsulant (UV + moisture) formulated to protect components in shadowed and hard-to-reach areas. It’s ideal for state-of-the-art electronic applications such as chip-on-board, flex circuits, and wirebond protection.
Features
- Dual cure: UV/Visible light creates a tack-free layer immediately, followed by ambient moisture cure in shadowed regions
- Flexible with strong resistance to moisture and thermal cycling, minimizing mechanical stress
- Excellent adhesion to FR4, Kapton®, and glass
- Single-component, low-VOC, solvent-free formulation
- Halogen-free and RoHS 2015/863/EU compliant
Specifications
- Viscosity: 25,000 cP
- Cured appearance: Clear
- Hardness (Shore D): D30–D50
- Tensile strength: ~4.9 MPa (718 psi)
- Elongation at break: ~36%
- Modulus of elasticity: ~17.6 MPa (2,560 psi)
- Glass transition (Tg): ~58 °C
- Coefficient of Thermal Expansion (CTE): ~81–152 µm/m·°C
- Dielectric strength: ~614 V/mil
- Volume resistivity: ~2.6×10¹³ Ω·cm
- Density: ~1.09 g/ml
- Water absorption: ~0.4% (2 h in boiling water)
- Linear shrinkage: ~2.0%
Applications
- Chip-on-board, chip-on-flex, chip-on-glass encapsulation
- Wirebond protection and PCB encapsulation
- Electronics requiring durability against moisture and thermal stress (medical, automotive, aerospace)
Benefits
- UV cure yields a tack-free surface quickly, enabling early handling
- Ambient moisture cure fills in shadowed areas within 2–3 days, simplifying production
- No refrigeration needed; energy and cost savings
- Flexible formulation reduces mechanical stress on delicate components
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
