Dymax Multi‑Cure 9‑20557‑LV is a clear LV‑grade encapsulant with dual-curing (UV + heat), optimized for electronic components and LEDs—including shadowed zones. Its low viscosity enables precise dispensing and even coverage on small, fine-pitch areas.
Key Features
- Dual cure (UV + heat): UV creates a tack‑free surface quickly; heat completes cure in shadowed areas for full protection.
- Low viscosity, easy handling: Ideal for dispensing into narrow gaps and small pads.
- Flexible and low stress: Suitable for wirebond, LED, and thin-chip protection.
- Excellent adhesion on FR4, silicone, glass, and LED package substrates.
- One-part, no-mix formula: Solvent-free, low-VOC, time-efficient, and error-reducing.
- Halogen-free and RoHS compliant
Specifications
- Viscosity: ~3,000 cP
- Cured appearance: Clear
- Hardness (Shore D): D25–D40
- Tensile strength: ~5–6 MPa
- Elongation at break: ~100–150%
- Modulus: ~20–30 MPa
- Tg: ~45–60 °C
- CTE: ~80–150 µm/m·°C
- Dielectric strength: ~500–600 V/mil
- Volume resistivity: ~1–5×10¹³ Ω·cm
- Cure shrinkage: <2%
- Water absorption (2 h): <0.5%
Applications
- Encapsulation for chip-on-board, LEDs, and thin-chip devices
- Wirebond protection and flexible PCB encapsulation
- Precision-critical applications: sensors, medical devices, wearables
- Benefits
- Streamlined workflow: fast tack‑free cure and efficient line speed
- Reliable protection: reduces mechanical and thermal stress on sensitive components
- Precise dispensing: low viscosity ensures controlled application
- Energy-efficient processing: minimal use of heat, no need for cold storage
- Eco-friendly & safe: low VOC, halogen-free, RoHS compliant
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
