Multi-Cure 9-20801 is a UV, heat, and/or activator-curable thermal interface adhesive designed for mounting heat-sensitive components on printed circuit boards (PCBs). It forms highly conductive bonds to heat dissipation components such as heat sinks.
The product features high thixotropy for easy dispensing and precise placement. In high-speed assembly, 9-20801 is typically dispensed onto one substrate while a thin layer of 501-E-REV-A activator is applied to the opposite component surface. The parts are then joined and exposed to UV light, curing the adhesive at the edges in seconds for immediate handling. The adhesive between opaque substrates cures over time with heat or activator, typically within minutes or hours. This enables uninterrupted production flow while ensuring complete curing in shadowed areas.
Compatible substrates include PCB, FR4, silicon, ceramic, lead frames, and various metals.
Dymax materials are solvent-free and cure upon exposure to light, providing faster processing, higher output, and reduced costs. When cured with Dymax UV spot lamps, focused beam lamps, flood lamps, or conveyor systems, they deliver optimal performance. Multi-CureĀ® 9-20801 is fully compliant with the RoHS2 Directives 2015/863/EC.
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
