Dymax Multi-Cure 9001-E-V3.0 is a clear encapsulant designed for electronics and PCB applications. It features dual-cure capability (UV + heat), strong adhesion, excellent flexibility, and enhanced resistance to harsh environments.
Features
- Cures quickly under UV/Visible light; heat cures shaded areas
- Excellent resistance to thermal cycling and humidity
- Strong adhesion to a wide range of electronic substrates
- 1-part, no-mix, solvent-free, isocyanate-free formulation
- High elongation and tensile strength for wirebond protection
- Compliant with RoHS 2015/863/EU
Specifications
- Viscosity: 4,500 cP
- Appearance: Clear liquid
- Hardness (Shore D): 45
- Tensile strength: 750 psi
- Elongation: 150%
- Volume resistivity: ~5.55Ć10Ā¹ā“ Ī©Ā·cm
- Dielectric strength: 500 V/mil
- Service temperature: ā54 Ā°C to +150 Ā°C
- Flash point: 101 Ā°C
Applications
- Chip-on-board, chip-on-flex, multi-chip module encapsulation
- Wirebond protection and PCB potting
- Electronics requiring high resistance to humidity and temperature variations
Benefits
- Fast curing speeds improve productivity
- Enhanced component protection against moisture and thermal stress
- Simplifies production with easy-to-use 1-part formula
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
