Dymax Multi‑Cure 9001‑E‑V3.1 is a high-performance, clear encapsulant formulated for electronic and PCB applications. It utilizes dual-curing technology to ensure complete cure in all areas.
Features
- Rapid UV/Visible cure: Sets in seconds under light exposure; shadowed areas cure with a secondary heat step.
- 1-part, no-mix formula: Simplifies processing, reduces errors-solvent-free and isocyanate-free.
- Flexible & low-stress: 150% elongation, low modulus and Tg protect wirebond integrity.
- Electrical and environmental robustness: Dielectric strength 500 V/mil; volume resistivity ~5.55×10¹⁴ Ω·cm; excellent moisture/thermal cycle resistance.
- RoHS-compliant & solvent-free: Meets RoHS2 2015/863/EU.
Specifications
- Viscosity: 4,500 cP
- Appearance: Clear liquid
- Durometer hardness: D45
- Tensile strength: 750 psi (~5 MPa)
- Elongation at break: 150%
- Volume resistivity: 5.55×10¹⁴ Ω·cm
- Dielectric strength: 500 V/mil
- Flash point: 101 °C
- Service temperature: –54 °C to +150 °C (for V3.5 grade)
Applications
- Chip-on-board, chip-on-flex, multi-chip modules
- Wirebond protection and PCB encapsulation
- Electronics in demanding environments: automotive, aerospace, medical
Benefits
- Enhanced throughput: Fast cure speeds increase production efficiency
- Superior component protection: Minimizes mechanical and chemical stress
- Reduced process complexity: No mixing needed—streamlines materials handling
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
