Get 100 mW of uncooled output power and 300 mW of output power when cooled, to enable 100 Gbps and 200 Gbps per lane, respectively, for cutting-edge O-band transceivers.
These chips are available in four wavelength bands to match coarse division multiplexing (CWDM) wavelength requirements in uncooled DR4 and DR8 transceivers. They feature high reliability and are qualified according to GR-468 for use in non-hermetic packages.
Get these chips tested and Inspected on translucent tape with grip-ring Ø 150 mm. Future-proof technology that can support advanced silicon transceiver designs to 1.6T
Key Features
Designed for uncooled O-band CWDM4
Qualified according to GR-468 for use in non-hermetic packages
Excellent reliability
Top anode and backside cathode configuration
RoHS compliant
Available wavelengths - CWDM4 1270 nm to 1330 nm
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Describe
Get 100 mW of uncooled output power and 300 mW of output power when cooled, to enable 100 Gbps and 200 Gbps per lane, respectively, for cutting-edge O-band transceivers.
These chips are available in four wavelength bands to match coarse division multiplexing (CWDM) wavelength requirements in uncooled DR4 and DR8 transceivers. They feature high reliability and are qualified according to GR-468 for use in non-hermetic packages.
Key Features
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com