Incure EncapTM UV encapsulants are ideal for applications such as Bare Die Encapsulation, Chip-On-Board, Chip-On-Flex Encapsulation, Chip-On-Glass, Flex Circuit Bonding / Attachment, Multi-Chip Modules, Wire Bonding etc. These one part, no-mix products cure in seconds for immediate inspection in high assembly operations. Excellent proctection on flexible and rigid platforms. Advantages of Encap - UV Encapsulants:
- Superior Adhesion to PET & Polyimide
- Low Stress Under Thermal Cycling
- Room Storage
- Thermal Shock and Moisture Resistant
Incure Encap 3522 is a 100% solids UV/Visible light curable low viscosity, component encapsulating material used in the electronics industry. It is acidfree, contains no volatiles and is environmentally-friendly. With full cure, it forms a clear hard and resilient protective coating thickness of a minimum 300 microns and up to 4,500 microns on components. Incure 3522 provides a sleek surface upon full cure with very low water absorption property. Product is non-DG with an 12-month shelf-life in unopened container.
- Product Highlights: Low viscosity encapsulant. Clear, hard, sleek and resilient protective coating thickness of 300 to 4,500 microns on components. Very low water absorption.
- Substrates: Low Adhesion
- Color: Clear
- Viscosity: 20 cP
- Tensile (psi): 150
- Hardness: D84 ā D94
- Elongation: 4%
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
