Incure EnCap 3555 UV/Visible Light/LED curable adhesive is an acid-free, low stress and low shrinkage optical encapsulant used in the opto-electronics industry. Specifically designed for longer staging times on sensitive flexible circuits, it cures in seconds to form a tough and sleek protective coating on components and PCBAs. Formulated with enhanced moisture and temperature resistance, Incure 3555 exhibits very low water absorption. A 100% solids formulation, it contains no volatiles and it is ideal for product requiring thermal cycling.
- Product Highlights: Ultra-low stress, clear electronic component encapsulant. Fast curing with good light transmission properties. Enhanced moisture and temperature resistance. Does not attack the flexible circuit easily.
- Substrates: Multi-Substrates (Low Adhesion)
- Color: Clear
- Viscosity: 20 cP
- Tensile (psi): 4,150
- Hardness: D63 ā D73
- Elongation: 32%
Incure EncapTM UV encapsulants are ideal for applications such as Bare Die Encapsulation, Chip-On-Board, Chip-On-Flex Encapsulation, Chip-On-Glass, Flex Circuit Bonding / Attachment, Multi-Chip Modules, Wire Bonding etc. These one part, no-mix products cure in seconds for immediate inspection in high assembly operations. Excellent proctection on flexible and rigid platforms.
Advantages of Encap - UV Encapsulants:
- Superior Adhesion to PET & Polyimide
- Low Stress Under Thermal Cycling
- Room Storage
- Thermal Shock and Moisture Resistant
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
