Multi-Cure 9037-F ā Encapsulant and Wire Bond Adhesive with Secondary Heat Cure
Multi-Cure 9037-F is a high-performance, thixotropic, UV/Visible light-curable encapsulant formulated for critical chip protection and wire bonding applications. This high-viscosity resin is ideal for glob top encapsulation in chip-on-glass (COG), chip-on-board (COB), and chip-on-flex (COF) configurations, where precise control and coverage are essential. It also functions as a reliable damming material in hybrid microelectronic assemblies.
Designed for dual-curing, 9037-F cures rapidly under broad-spectrum UV/Visible light and features a secondary thermal cure mechanism for complete polymerization in shadowed or hard-to-reach areas. Once cured, it forms a tough yet flexible encapsulant that provides excellent resistance to moisture, temperature, and environmental stress. The material fluoresces blue under black light, simplifying post-cure inspection and quality control.
Dymax adhesives contain no non-reactive solvents and are engineered for fast, efficient processing. When used with Dymax curing systemsāincluding spot lamps, focused-beam lamps, flood lamps, and conveyor units-9037-F delivers optimum cure speed, depth, and performance.
This product complies fully with the RoHS2 Directives 2015/863/EU, making it suitable for environmentally conscious applications.
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
