Vitrified bond grinding wheels are manufactured using a high-temperature ceramic bonding process that creates a hard, stable structure with adjustable porosity. By controlling pore size and bond structure, the wheel allows efficient chip removal, reduced heat generation, and significantly improved grinding performance.
ID Wheels
ID Wheelsare engineered for precision internal grinding applications requiring high accuracy and optimal material removal rates.
Key Advantages
- Reduced grinding forces, enabling smoother and more stable machining.
- High material removal rate, ideal for continuous production cycles.
- Shortened cycle times, improving overall manufacturing productivity.
These wheels are widely used for high-precision bore grinding, especially in the bearing industry, including:
- Ball bearings
- Taper bearings
Their strong and stable cutting ability ensures superior surface finishing and tight tolerance control.
Insert Grinding Wheel
Insert Grinding Wheel are designed to meet the stringent requirements of wafer thinning processes in the semiconductor industry.
- Optimized for silicon wafer surface grinding, delivering excellent flatness and smoothness.
- Ideal for thin-film back-grinding applications, ensuring stable processing and precise thickness control.
Used in advanced wafer-processing operations for:
- Silicon wafers – semiconductor chips, MEMS, IC fabrication
- Sapphire wafers – LED production, sensors, and optical components
Silicon Grinding Wheels
LECI’s SiC Grinding Wheels are developed to deliver high cutting performance and long-term stability in demanding grinding applications.
- Shorter cycle times due to fast and consistent cutting performance.
- Extended dressing intervals, minimizing machine downtime.
Ideal for hard, brittle, and advanced engineering materials such as:
- Carbide inserts
- Ceramic inserts
- Cermet inserts
- PCD / PCBN inserts
SiC wheels provide sharp cutting action, stable surface quality, and excellent durability for precision tool and component manufacturing.
PCD / PCBN Grinding Wheels
LECI’s PCD/PCBN Grinding Wheels are engineered to meet the ultra-high precision requirements of super-hard material grinding.
- Reduced cycle time thanks to fast grinding speed and low cutting force.
- Long dressing intervals, ensuring stable performance and reduced downtime.
Optimized for high-hardness inserts and precision cutting tools, including:
- Carbide inserts
- Ceramic inserts
- Cermet inserts
- PCD / PCBN inserts
These wheels deliver exceptional sharpness, excellent surface finishing, and highly accurate dimensional control in tool manufacturing.
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
