LECI supplies VSM (Very Soft Metal) bond grinding wheels tailored to customer specifications, engineered for high-precision grinding applications. By integrating the advantages of resin, metal, and vitrified bonds, VSM wheels deliver exceptional cutting performance, superior wear resistance, and extended operating cycles without dressing. LECI provides full customization—size, shape, grit, and bond characteristics—ensuring optimal performance for grinding CVD SiC, ceramic, carbide, and cermet materials in modern production environments.
VSM Bond Technology
The VSM bond system is an advanced hybrid technology developed to combine the key strengths of three traditional bond types: resin, metal, and vitrified. The result is a grinding wheel with outstanding wear resistance, excellent form retention, and extremely long tool life with virtually no dressing required.
Key Advantages
Bond Structural Characteristics
Fine, uniform porosity → reduces cutting forces and improves heat dissipation
Larger pore structures → enhances chip evacuation and helps maintain wheel form during grinding
Insert Tip Grinding Wheels
Insert Tip Grinding Wheels are designed specifically for roughing and finishing operations on cutting tool inserts. Using VSM bond technology, these wheels provide high stability, precise form control, and significantly reduced dressing frequency throughout the grinding process.
Key Features
Superior grinding performance with stable and consistent surface quality
Easy dressing, reducing maintenance time
Long dressing intervals, ideal for continuous production
Suitable for grinding:
Tungsten carbide inserts
Ceramic inserts
Cermet inserts
PCD / PCBN inserts
Contact infomation:
LECI Co., Ltd
R-1901, Saigon Trade Center Bld, 37 Ton Duc Thang Str., Ben Nghe W., Dist. 1, HCM City 70000, VN.
Long Bien, Ha Noi, VN.
Phone: (+84) 901442689 (WhatsApp)
Hotline: 02822202988
Website: lecilaser.com
